EP2C70F896C6N vs EP2C70F896I8 feature comparison

EP2C70F896C6N Intel Corporation

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EP2C70F896I8 Altera Corporation

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Rohs Code Yes No
Part Life Cycle Code Active Transferred
Ihs Manufacturer INTEL CORP ALTERA CORP
Package Description LEAD FREE, FBGA-896 FBGA-896
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature ALSO REQUIRES 3.3 SUPPLY ALSO REQUIRES 3.3 SUPPLY
Clock Frequency-Max 500 MHz 402.5 MHz
JESD-30 Code S-PBGA-B896 S-PBGA-B896
JESD-609 Code e1 e0
Length 31 mm 31 mm
Moisture Sensitivity Level 3 3
Number of CLBs 4276 4276
Number of Inputs 622 622
Number of Logic Cells 68416 68416
Number of Outputs 606 606
Number of Terminals 896 896
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 4276 CLBS 4276 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA896,30X30,40 BGA896,30X30,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.25 V 1.25 V
Supply Voltage-Min 1.15 V 1.15 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 31 mm 31 mm
Base Number Matches 1 2
Pbfree Code No
Part Package Code BGA
Pin Count 896
Peak Reflow Temperature (Cel) 220
Time@Peak Reflow Temperature-Max (s) 20

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