EP2C70F896C6N
vs
EP2C70F896I8
feature comparison
All Stats
Differences Only
Rohs Code
Yes
No
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
INTEL CORP
ALTERA CORP
Package Description
LEAD FREE, FBGA-896
FBGA-896
Reach Compliance Code
compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
ALSO REQUIRES 3.3 SUPPLY
ALSO REQUIRES 3.3 SUPPLY
Clock Frequency-Max
500 MHz
402.5 MHz
JESD-30 Code
S-PBGA-B896
S-PBGA-B896
JESD-609 Code
e1
e0
Length
31 mm
31 mm
Moisture Sensitivity Level
3
3
Number of CLBs
4276
4276
Number of Inputs
622
622
Number of Logic Cells
68416
68416
Number of Outputs
606
606
Number of Terminals
896
896
Operating Temperature-Max
85 °C
Operating Temperature-Min
Organization
4276 CLBS
4276 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA896,30X30,40
BGA896,30X30,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.6 mm
2.6 mm
Supply Voltage-Max
1.25 V
1.25 V
Supply Voltage-Min
1.15 V
1.15 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
31 mm
31 mm
Base Number Matches
1
2
Pbfree Code
No
Part Package Code
BGA
Pin Count
896
Peak Reflow Temperature (Cel)
220
Time@Peak Reflow Temperature-Max (s)
20
Compare EP2C70F896C6N with alternatives
Compare EP2C70F896I8 with alternatives