EP2C35F484I8N
vs
EP2C35F484C7
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
INTEL CORP
ALTERA CORP
Package Description
LEAD FREE, FBGA-484
FBGA-484
Reach Compliance Code
compliant
not_compliant
ECCN Code
3A991
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Intel
Additional Feature
ALSO REQUIRES 3.3 SUPPLY
ALSO REQUIRES 3.3 SUPPLY
Clock Frequency-Max
402.5 MHz
450 MHz
JESD-30 Code
S-PBGA-B484
S-PBGA-B484
JESD-609 Code
e1
e0
Length
23 mm
23 mm
Moisture Sensitivity Level
3
3
Number of CLBs
2076
2076
Number of Inputs
322
322
Number of Logic Cells
33216
33216
Number of Outputs
306
306
Number of Terminals
484
484
Organization
2076 CLBS
2076 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA484,22X22,40
BGA484,22X22,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
260
220
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.6 mm
2.6 mm
Supply Voltage-Max
1.25 V
1.25 V
Supply Voltage-Min
1.15 V
1.15 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
20
Width
23 mm
23 mm
Base Number Matches
1
3
Pbfree Code
Part Package Code
BGA
Pin Count
484
Operating Temperature-Max
85 °C
Operating Temperature-Min
Temperature Grade
OTHER
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