EP2C15AF256C6NES vs EP2C15AF256I8 feature comparison

EP2C15AF256C6NES Altera Corporation

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EP2C15AF256I8 Intel Corporation

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Transferred Active
Ihs Manufacturer ALTERA CORP INTEL CORP
Part Package Code BGA
Package Description LBGA, FBGA-256
Pin Count 256
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 500 MHz
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e1 e0
Length 17 mm 17 mm
Number of CLBs 903
Number of Terminals 256 256
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 903 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.55 mm 1.55 mm
Supply Voltage-Max 1.25 V 1.25 V
Supply Voltage-Min 1.15 V 1.15 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Temperature Grade OTHER
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 17 mm 17 mm
Base Number Matches 2 2
Additional Feature ALSO REQUIRES 3.3 SUPPLY
Number of Inputs 152
Number of Logic Cells 14448
Number of Outputs 144
Package Equivalence Code BGA256,16X16,40

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