Findchips: Compare EP2AGX45DF25C6 vs EP2AGX45DF25C6N

EP2AGX45DF25C6 vs EP2AGX45DF25C6N feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	No	Yes
Part Life Cycle Code	Obsolete	Transferred
Ihs Manufacturer	INTEL CORP	ALTERA CORP
Reach Compliance Code	compliant	not_compliant
HTS Code	8542.39.00.01	8542.39.00.01
JESD-30 Code	S-PBGA-B572	S-PBGA-B572
Length	25 mm	25 mm
Number of Inputs	252	252
Number of Logic Cells	42959	42959
Number of Outputs	252	252
Number of Terminals	572	572
Operating Temperature-Max	85 °C	85 °C
Operating Temperature-Min
Organization	1805 CLBS
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	HBGA
Package Equivalence Code	BGA572,24X24,40	BGA572,24X24,40
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Cel)	NOT SPECIFIED	260
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	2.2 mm	2.2 mm
Supply Voltage-Max	0.93 V	0.93 V
Supply Voltage-Min	0.87 V	0.87 V
Supply Voltage-Nom	0.9 V	0.9 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED	30
Width	25 mm	25 mm
Base Number Matches	4	1
Pbfree Code		Yes
Part Package Code		BGA
Package Description		25 X 25 MM, LEAD FREE, MS-034, FBGA-572
Pin Count		572
Clock Frequency-Max		500 MHz
JESD-609 Code		e1
Moisture Sensitivity Level		3
Temperature Grade		OTHER
Terminal Finish		TIN SILVER COPPER
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays