EP20K60EFC324-1X vs EP20K60EFC324-3N feature comparison

EP20K60EFC324-1X Intel Corporation

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EP20K60EFC324-3N Altera Corporation

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Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEL CORP ALTERA CORP
Package Description FINE LINE, BGA-324 FINE LINE, BGA-324
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Clock Frequency-Max 160 MHz 160 MHz
JESD-30 Code S-PBGA-B324 S-PBGA-B324
JESD-609 Code e0 e1
Length 19 mm 19 mm
Moisture Sensitivity Level 3 3
Number of Dedicated Inputs 4 4
Number of I/O Lines 196 196
Number of Inputs 188 188
Number of Logic Cells 2560 2560
Number of Outputs 188 188
Number of Terminals 324 324
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 4 DEDICATED INPUTS, 196 I/O 4 DEDICATED INPUTS, 196 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA324,18X18,40 BGA324,18X18,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type LOADABLE PLD LOADABLE PLD
Propagation Delay 1.72 ns 3.56 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.5 mm 3.5 mm
Supply Voltage-Max 1.89 V 1.89 V
Supply Voltage-Min 1.71 V 1.71 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 19 mm 19 mm
Base Number Matches 2 2
Pbfree Code Yes
Part Package Code BGA
Pin Count 324
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

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