EP20K200BC356-2
vs
EP20K200BC356-3
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEL CORP
ALTERA CORP
Package Description
LBGA, BGA356,26X26,50
BGA-356
Reach Compliance Code
compliant
not_compliant
ECCN Code
3A991.D
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B356
S-PBGA-B356
JESD-609 Code
e0
e0
Length
35 mm
35 mm
Moisture Sensitivity Level
3
3
Number of Dedicated Inputs
4
4
Number of I/O Lines
277
277
Number of Inputs
271
271
Number of Logic Cells
8320
8320
Number of Outputs
271
271
Number of Terminals
356
356
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
4 DEDICATED INPUTS, 277 I/O
4 DEDICATED INPUTS, 277 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA356,26X26,50
BGA356,26X26,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Programmable Logic Type
LOADABLE PLD
LOADABLE PLD
Propagation Delay
3 ns
3.6 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.63 mm
1.63 mm
Supply Voltage-Max
2.625 V
2.625 V
Supply Voltage-Min
2.375 V
2.375 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
35 mm
35 mm
Base Number Matches
2
2
Pbfree Code
Part Package Code
BGA
Pin Count
356
Peak Reflow Temperature (Cel)
220
Time@Peak Reflow Temperature-Max (s)
20
Compare EP20K200BC356-2 with alternatives
Compare EP20K200BC356-3 with alternatives