EP20K100QI208-2N vs EP20K100BC356-2N feature comparison

EP20K100QI208-2N Intel Corporation

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EP20K100BC356-2N Altera Corporation

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEL CORP ALTERA CORP
Package Description FQFP, BGA-356
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PQFP-G208 S-PBGA-B356
JESD-609 Code e3 e1
Length 28 mm 35 mm
Moisture Sensitivity Level 3 3
Number of Dedicated Inputs 4 4
Number of I/O Lines 159 252
Number of Terminals 208 356
Organization 4 DEDICATED INPUTS, 159 I/O 4 DEDICATED INPUTS, 252 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FQFP LBGA
Package Shape SQUARE SQUARE
Package Style FLATPACK, FINE PITCH GRID ARRAY, LOW PROFILE
Programmable Logic Type LOADABLE PLD LOADABLE PLD
Propagation Delay 3 ns 3 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.1 mm 1.63 mm
Supply Voltage-Max 2.625 V 2.625 V
Supply Voltage-Min 2.375 V 2.375 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish MATTE TIN Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form GULL WING BALL
Terminal Pitch 0.5 mm 1.27 mm
Terminal Position QUAD BOTTOM
Width 28 mm 35 mm
Base Number Matches 1 1
Pbfree Code Yes
Part Package Code BGA
Pin Count 356
ECCN Code 3A991.D
Number of Inputs 246
Number of Logic Cells 4160
Number of Outputs 246
Operating Temperature-Max 85 °C
Operating Temperature-Min
Package Equivalence Code BGA356,26X26,50
Peak Reflow Temperature (Cel) 260
Temperature Grade OTHER
Time@Peak Reflow Temperature-Max (s) 30

Compare EP20K100QI208-2N with alternatives

Compare EP20K100BC356-2N with alternatives