EP20K100QI208-2N
vs
EP20K100BC356-2N
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
INTEL CORP
|
ALTERA CORP
|
Package Description |
FQFP,
|
BGA-356
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PQFP-G208
|
S-PBGA-B356
|
JESD-609 Code |
e3
|
e1
|
Length |
28 mm
|
35 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Dedicated Inputs |
4
|
4
|
Number of I/O Lines |
159
|
252
|
Number of Terminals |
208
|
356
|
Organization |
4 DEDICATED INPUTS, 159 I/O
|
4 DEDICATED INPUTS, 252 I/O
|
Output Function |
MACROCELL
|
MACROCELL
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
FQFP
|
LBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, FINE PITCH
|
GRID ARRAY, LOW PROFILE
|
Programmable Logic Type |
LOADABLE PLD
|
LOADABLE PLD
|
Propagation Delay |
3 ns
|
3 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.1 mm
|
1.63 mm
|
Supply Voltage-Max |
2.625 V
|
2.625 V
|
Supply Voltage-Min |
2.375 V
|
2.375 V
|
Supply Voltage-Nom |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
MATTE TIN
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Terminal Form |
GULL WING
|
BALL
|
Terminal Pitch |
0.5 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
BOTTOM
|
Width |
28 mm
|
35 mm
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Part Package Code |
|
BGA
|
Pin Count |
|
356
|
ECCN Code |
|
3A991.D
|
Number of Inputs |
|
246
|
Number of Logic Cells |
|
4160
|
Number of Outputs |
|
246
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
|
Package Equivalence Code |
|
BGA356,26X26,50
|
Peak Reflow Temperature (Cel) |
|
260
|
Temperature Grade |
|
OTHER
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare EP20K100QI208-2N with alternatives
Compare EP20K100BC356-2N with alternatives