EP20K100FC324-1V vs EP20K100FI324-2 feature comparison

EP20K100FC324-1V Rochester Electronics LLC

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EP20K100FI324-2 Intel Corporation

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS INC INTEL CORP
Part Package Code BGA
Package Description BGA, BGA, BGA324(UNSPEC)
Pin Count 324
Reach Compliance Code unknown compliant
Clock Frequency-Max 100 MHz
JESD-30 Code S-PBGA-B324 S-PBGA-B324
JESD-609 Code e1 e0
Length 19 mm 19 mm
Number of Dedicated Inputs 4 4
Number of I/O Lines 252 246
Number of Terminals 324 324
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 4 DEDICATED INPUTS, 252 I/O 4 DEDICATED INPUTS, 246 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type LOADABLE PLD LOADABLE PLD
Propagation Delay 2.5 ns
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 3.5 mm 2.1 mm
Supply Voltage-Max 2.625 V 2.625 V
Supply Voltage-Min 2.375 V 2.375 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 19 mm 19 mm
Base Number Matches 2 2
Rohs Code No
ECCN Code 3A991.D
HTS Code 8542.39.00.01
Moisture Sensitivity Level 3
Number of Inputs 246
Number of Logic Cells 4160
Number of Outputs 246
Package Equivalence Code BGA324(UNSPEC)