EP20K100EFC324-2X vs EP20K100EFI324-2XN feature comparison

EP20K100EFC324-2X Altera Corporation

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EP20K100EFI324-2XN Intel Corporation

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ALTERA CORP INTEL CORP
Part Package Code BGA
Package Description FINE LINE, BGA-324 BGA,
Pin Count 324
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Intel
Clock Frequency-Max 160 MHz
JESD-30 Code S-PBGA-B324 S-PBGA-B324
JESD-609 Code e0 e1
Length 19 mm 19 mm
Moisture Sensitivity Level 3
Number of Dedicated Inputs 4 4
Number of I/O Lines 246 246
Number of Inputs 238
Number of Logic Cells 4160
Number of Outputs 238
Number of Terminals 324 324
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 4 DEDICATED INPUTS, 246 I/O 4 DEDICATED INPUTS, 246 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA324,18X18,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 220
Programmable Logic Type LOADABLE PLD LOADABLE PLD
Propagation Delay 2.02 ns 2.02 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.5 mm 3.5 mm
Supply Voltage-Max 1.89 V 1.89 V
Supply Voltage-Min 1.71 V 1.71 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 19 mm 19 mm
Base Number Matches 2 1

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