EP20K100EBC356-1X
vs
EP20K100QI208-2
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
Package Description |
BGA-356
|
FQFP, QFP208,1.2SQ,20
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.D
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Intel
|
|
JESD-30 Code |
S-PBGA-B356
|
S-PQFP-G208
|
JESD-609 Code |
e0
|
e0
|
Length |
35 mm
|
28 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Dedicated Inputs |
4
|
4
|
Number of I/O Lines |
246
|
159
|
Number of Inputs |
238
|
153
|
Number of Logic Cells |
4160
|
4160
|
Number of Outputs |
238
|
153
|
Number of Terminals |
356
|
208
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
|
|
Organization |
4 DEDICATED INPUTS, 246 I/O
|
4 DEDICATED INPUTS, 159 I/O
|
Output Function |
MACROCELL
|
MACROCELL
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
FQFP
|
Package Equivalence Code |
BGA356,26X26,50
|
QFP208,1.2SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
FLATPACK, FINE PITCH
|
Programmable Logic Type |
LOADABLE PLD
|
LOADABLE PLD
|
Propagation Delay |
1.73 ns
|
3 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.63 mm
|
4.1 mm
|
Supply Voltage-Max |
1.89 V
|
2.625 V
|
Supply Voltage-Min |
1.71 V
|
2.375 V
|
Supply Voltage-Nom |
1.8 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
BALL
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
QUAD
|
Width |
35 mm
|
28 mm
|
Base Number Matches |
2
|
2
|
|
|
|
Compare EP20K100EBC356-1X with alternatives
Compare EP20K100QI208-2 with alternatives