EP20K100BC356-2N
vs
EP20K100FI324-2XV
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEL CORP
INTEL CORP
Package Description
LBGA, BGA356,26X26,50
FINE LINE, BGA-324
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.D
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B356
S-PBGA-B324
JESD-609 Code
e1
e0
Length
35 mm
19 mm
Moisture Sensitivity Level
3
3
Number of Dedicated Inputs
4
4
Number of I/O Lines
252
252
Number of Inputs
246
246
Number of Logic Cells
4160
4160
Number of Outputs
246
246
Number of Terminals
356
324
Operating Temperature-Max
85 °C
Operating Temperature-Min
Organization
4 DEDICATED INPUTS, 252 I/O
4 DEDICATED INPUTS, 252 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
BGA
Package Equivalence Code
BGA356,26X26,50
BGA324,18X18,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY
Programmable Logic Type
LOADABLE PLD
LOADABLE PLD
Propagation Delay
3 ns
3 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.63 mm
3.5 mm
Supply Voltage-Max
2.625 V
2.625 V
Supply Voltage-Min
2.375 V
2.375 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
35 mm
19 mm
Base Number Matches
2
2
Compare EP20K100BC356-2N with alternatives
Compare EP20K100FI324-2XV with alternatives