EP20K100BC356-1X
vs
EP20K100EBC356-1X
feature comparison
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
INTEL CORP
|
ALTERA CORP
|
Package Description |
,
|
BGA-356
|
Reach Compliance Code |
compliant
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Base Number Matches |
2
|
2
|
Pbfree Code |
|
No
|
Rohs Code |
|
No
|
Part Package Code |
|
BGA
|
Pin Count |
|
356
|
ECCN Code |
|
3A991.D
|
Samacsys Manufacturer |
|
Intel
|
JESD-30 Code |
|
S-PBGA-B356
|
JESD-609 Code |
|
e0
|
Length |
|
35 mm
|
Moisture Sensitivity Level |
|
3
|
Number of Dedicated Inputs |
|
4
|
Number of I/O Lines |
|
246
|
Number of Inputs |
|
238
|
Number of Logic Cells |
|
4160
|
Number of Outputs |
|
238
|
Number of Terminals |
|
356
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
|
Organization |
|
4 DEDICATED INPUTS, 246 I/O
|
Output Function |
|
MACROCELL
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
LBGA
|
Package Equivalence Code |
|
BGA356,26X26,50
|
Package Shape |
|
SQUARE
|
Package Style |
|
GRID ARRAY, LOW PROFILE
|
Peak Reflow Temperature (Cel) |
|
220
|
Programmable Logic Type |
|
LOADABLE PLD
|
Propagation Delay |
|
1.73 ns
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
1.63 mm
|
Supply Voltage-Max |
|
1.89 V
|
Supply Voltage-Min |
|
1.71 V
|
Supply Voltage-Nom |
|
1.8 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
OTHER
|
Terminal Finish |
|
TIN LEAD
|
Terminal Form |
|
BALL
|
Terminal Pitch |
|
1.27 mm
|
Terminal Position |
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
|
20
|
Width |
|
35 mm
|
|
|
|
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