EP1SGX10DF672C6N vs EP1SGX10CF672C7 feature comparison

EP1SGX10DF672C6N Intel Corporation

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EP1SGX10CF672C7 Intel Corporation

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP INTEL CORP
Package Description 27 X 27 MM, 1 MM PITCH, FBGA-672 27 X 27 MM, 1 MM PITCH, FBGA-672
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Clock Frequency-Max 5.37 MHz
Combinatorial Delay of a CLB-Max 8.245 ns
JESD-30 Code S-PBGA-B672 S-PBGA-B672
JESD-609 Code e1 e0
Length 27 mm 27 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1200 1200
Number of Inputs 362 366
Number of Logic Cells 10570 10570
Number of Outputs 362 366
Number of Terminals 672 672
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 1057 CLBS 1200 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA672,26X26,40 BGA672,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.5 mm 3.5 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm 27 mm
Base Number Matches 2 2

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