EP1SGX10DF672C5N
vs
EP1SGX10DF672C5
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
Yes
No
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
ALTERA CORP
INTEL CORP
Part Package Code
BGA
Package Description
27 X 27 MM, 1 MM PITCH, FBGA-672
27 X 27 MM, 1 MM PITCH, FBGA-672
Pin Count
672
Reach Compliance Code
not_compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B672
S-PBGA-B672
JESD-609 Code
e1
e0
Length
27 mm
27 mm
Moisture Sensitivity Level
3
3
Number of CLBs
1200
1200
Number of Inputs
362
366
Number of Logic Cells
10570
10570
Number of Outputs
362
366
Number of Terminals
672
672
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
1200 CLBS
1200 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA672,26X26,40
BGA672,26X26,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
245
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.5 mm
3.5 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
27 mm
27 mm
Base Number Matches
2
2
Compare EP1SGX10DF672C5N with alternatives
Compare EP1SGX10DF672C5 with alternatives