EP1SGX10CF672C6
vs
EP1SGX10CF672C7
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEL CORP
ALTERA CORP
Package Description
27 X 27 MM, 1 MM PITCH, FBGA-672
27 X 27 MM, 1 MM PITCH, FBGA-672
Reach Compliance Code
compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B672
S-PBGA-B672
JESD-609 Code
e0
e0
Length
27 mm
27 mm
Moisture Sensitivity Level
3
3
Number of CLBs
1200
1200
Number of Inputs
366
366
Number of Logic Cells
10570
10570
Number of Outputs
366
366
Number of Terminals
672
672
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
1200 CLBS
1200 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA672,26X26,40
BGA672,26X26,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.5 mm
3.5 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
27 mm
27 mm
Base Number Matches
3
3
Pbfree Code
No
Part Package Code
BGA
Pin Count
672
Peak Reflow Temperature (Cel)
220
Time@Peak Reflow Temperature-Max (s)
20
Compare EP1SGX10CF672C6 with alternatives
Compare EP1SGX10CF672C7 with alternatives