EP1SGX10CF672C6 vs EP1SGX10CF672C7 feature comparison

EP1SGX10CF672C6 Intel Corporation

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EP1SGX10CF672C7 Altera Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEL CORP ALTERA CORP
Package Description 27 X 27 MM, 1 MM PITCH, FBGA-672 27 X 27 MM, 1 MM PITCH, FBGA-672
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B672 S-PBGA-B672
JESD-609 Code e0 e0
Length 27 mm 27 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1200 1200
Number of Inputs 366 366
Number of Logic Cells 10570 10570
Number of Outputs 366 366
Number of Terminals 672 672
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 1200 CLBS 1200 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA672,26X26,40 BGA672,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.5 mm 3.5 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm 27 mm
Base Number Matches 3 3
Pbfree Code No
Part Package Code BGA
Pin Count 672
Peak Reflow Temperature (Cel) 220
Time@Peak Reflow Temperature-Max (s) 20

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