EP1S30F780I7 vs EP1S30F780C7 feature comparison

EP1S30F780I7 Altera Corporation

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EP1S30F780C7 Intel Corporation

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ALTERA CORP INTEL CORP
Part Package Code BGA
Package Description BGA, BGA780,28X28,40 29 X 29 MM, 1 MM PITCH, FBGA-780
Pin Count 780
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B780 S-PBGA-B780
JESD-609 Code e0 e0
Moisture Sensitivity Level 3 3
Number of Inputs 726 597
Number of Logic Cells 32470 32470
Number of Outputs 726 597
Number of Terminals 780 780
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA780,28X28,40 BGA780,28X28,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 220
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Base Number Matches 2 3
Length 29 mm
Number of CLBs 3819
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 3427 CLBS
Seated Height-Max 3.5 mm
Temperature Grade COMMERCIAL EXTENDED
Width 29 mm

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