Findchips: Compare EP1S30F780I6 vs EP1S30F780C6

EP1S30F780I6 vs EP1S30F780C6 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Pbfree Code	No
Rohs Code	No	No
Part Life Cycle Code	Transferred	Obsolete
Ihs Manufacturer	ALTERA CORP	INTEL CORP
Part Package Code	BGA
Package Description	29 X 29 MM, 1 MM PITCH, FBGA-780	29 X 29 MM, 1 MM PITCH, FBGA-780
Pin Count	780
Reach Compliance Code	not_compliant	compliant
HTS Code	8542.39.00.01	8542.39.00.01
JESD-30 Code	S-PBGA-B780	S-PBGA-B780
JESD-609 Code	e0	e0
Length	29 mm	29 mm
Moisture Sensitivity Level	3	3
Number of CLBs	3819	3819
Number of Inputs	726	597
Number of Logic Cells	32470	32470
Number of Outputs	726	597
Number of Terminals	780	780
Organization	3819 CLBS	3427 CLBS
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Equivalence Code	BGA780,28X28,40	BGA780,28X28,40
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Cel)	220
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	3.5 mm	3.5 mm
Supply Voltage-Max	1.575 V	1.575 V
Supply Voltage-Min	1.425 V	1.425 V
Supply Voltage-Nom	1.5 V	1.5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Terminal Finish	TIN LEAD	TIN LEAD
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Time@Peak Reflow Temperature-Max (s)	20
Width	29 mm	29 mm
Base Number Matches	3	3
Operating Temperature-Max		85 °C
Operating Temperature-Min
Temperature Grade		COMMERCIAL EXTENDED
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays