EP1S30F780C8 vs EP1S30F780I6 feature comparison

EP1S30F780C8 Altera Corporation

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EP1S30F780I6 Altera Corporation

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer ALTERA CORP ALTERA CORP
Part Package Code BGA BGA
Package Description 29 X 29 MM, 1 MM PITCH, FBGA-780 29 X 29 MM, 1 MM PITCH, FBGA-780
Pin Count 780 780
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B780 S-PBGA-B780
JESD-609 Code e0 e0
Length 29 mm 29 mm
Moisture Sensitivity Level 3 3
Number of CLBs 3819 3819
Number of Inputs 726 726
Number of Logic Cells 32470 32470
Number of Outputs 726 726
Number of Terminals 780 780
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 3819 CLBS 3819 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HBGA BGA
Package Equivalence Code BGA780,28X28,40 BGA780,28X28,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG GRID ARRAY
Peak Reflow Temperature (Cel) 220 220
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.5 mm 3.5 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20 20
Width 29 mm 29 mm
Base Number Matches 2 3

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