Findchips: Compare EP1S30F780C7ES vs EP1S30F780C6

EP1S30F780C7ES vs EP1S30F780C6 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	No	No
Part Life Cycle Code	Obsolete	Transferred
Ihs Manufacturer	INTEL CORP	ALTERA CORP
Package Description	BGA,	29 X 29 MM, 1 MM PITCH, FBGA-780
Reach Compliance Code	compliant	not_compliant
HTS Code	8542.39.00.01	8542.39.00.01
JESD-30 Code	S-PBGA-B780	S-PBGA-B780
JESD-609 Code	e0	e0
Length	29 mm	29 mm
Number of Inputs	597	726
Number of Outputs	597	726
Number of Terminals	780	780
Operating Temperature-Max	85 °C	85 °C
Operating Temperature-Min
Organization	3247 CLBS	3819 CLBS
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	3.2 mm	3.5 mm
Supply Voltage-Max	1.575 V	1.575 V
Supply Voltage-Min	1.425 V	1.425 V
Supply Voltage-Nom	1.5 V	1.5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	OTHER	COMMERCIAL EXTENDED
Terminal Finish	TIN LEAD	TIN LEAD
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Width	29 mm	29 mm
Base Number Matches	1	3
Pbfree Code		No
Part Package Code		BGA
Pin Count		780
Moisture Sensitivity Level		3
Number of CLBs		3819
Number of Logic Cells		32470
Package Equivalence Code		BGA780,28X28,40
Peak Reflow Temperature (Cel)		220
Time@Peak Reflow Temperature-Max (s)		20
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays