EP1S30F780C6N vs EP1S30F780I7ES feature comparison

EP1S30F780C6N Altera Corporation

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EP1S30F780I7ES Intel Corporation

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Transferred Active
Ihs Manufacturer ALTERA CORP INTEL CORP
Part Package Code BGA
Package Description 29 X 29 MM, 1 MM PITCH, LEAD FREE, FBGA-780 29 X 29 MM, 1 MM PITCH, FBGA-780
Pin Count 780
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B780 S-PBGA-B780
JESD-609 Code e1 e0
Length 29 mm 29 mm
Moisture Sensitivity Level 3
Number of CLBs 3819 3247
Number of Inputs 726
Number of Logic Cells 32470 32470
Number of Outputs 726
Number of Terminals 780 780
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C
Organization 3819 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA780,28X28,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.5 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL EXTENDED
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 29 mm 29 mm
Base Number Matches 2 2

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