EP1S30F780C5ES
vs
EP1S30F780C7
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEL CORP
ALTERA CORP
Package Description
BGA,
29 X 29 MM, 1 MM PITCH, FBGA-780
Reach Compliance Code
compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B780
S-PBGA-B780
JESD-609 Code
e0
e0
Length
29 mm
29 mm
Number of Inputs
597
726
Number of Outputs
597
726
Number of Terminals
780
780
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
3247 CLBS
3819 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.2 mm
3.5 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
COMMERCIAL EXTENDED
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
29 mm
29 mm
Base Number Matches
2
2
Pbfree Code
Part Package Code
BGA
Pin Count
780
Moisture Sensitivity Level
3
Number of CLBs
3819
Number of Logic Cells
32470
Package Equivalence Code
BGA780,28X28,40
Peak Reflow Temperature (Cel)
220
Time@Peak Reflow Temperature-Max (s)
20
Compare EP1S30F780C5ES with alternatives
Compare EP1S30F780C7 with alternatives