EP1S30F1020I7 vs EP1S30F1020I6 feature comparison

EP1S30F1020I7 Intel Corporation

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EP1S30F1020I6 Intel Corporation

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Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer INTEL CORP INTEL CORP
Package Description 33 X 33 MM, 1 MM PITCH, FBGA-1020 BGA, BGA1020,31X31,50
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B1020 S-PBGA-B1020
JESD-609 Code e0 e0
Length 33 mm 33 mm
Number of CLBs 3247 3819
Number of Inputs 726 726
Number of Logic Cells 32470 32470
Number of Outputs 726 726
Number of Terminals 1020 1020
Operating Temperature-Max 100 °C 100 °C
Operating Temperature-Min -40 °C -40 °C
Organization 3247 CLBS 3427 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1020,31X31,50 BGA1020,31X31,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 33 mm 33 mm
Base Number Matches 2 3
Moisture Sensitivity Level 3
Seated Height-Max 3.5 mm

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