EP1S25F780I6
vs
EP1S25F780C5N
feature comparison
All Stats
Differences Only
Pbfree Code
No
Rohs Code
No
Yes
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
ALTERA CORP
INTEL CORP
Part Package Code
BGA
Package Description
29 X 29 MM, 1 MM PITCH, FBGA-780
BGA, BGA780,28X28,40
Pin Count
780
Reach Compliance Code
not_compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B780
S-PBGA-B780
JESD-609 Code
e0
e1
Length
29 mm
29 mm
Moisture Sensitivity Level
3
3
Number of CLBs
2852
2852
Number of Inputs
706
597
Number of Logic Cells
25660
25660
Number of Outputs
706
597
Number of Terminals
780
780
Organization
2852 CLBS
2566 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA780,28X28,40
BGA780,28X28,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
220
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.5 mm
3.5 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
Width
29 mm
29 mm
Base Number Matches
2
2
Operating Temperature-Max
85 °C
Operating Temperature-Min
Temperature Grade
COMMERCIAL EXTENDED
Compare EP1S25F780I6 with alternatives
Compare EP1S25F780C5N with alternatives