EP1S25F780I6 vs EP1S25F780C5N feature comparison

EP1S25F780I6 Altera Corporation

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EP1S25F780C5N Intel Corporation

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ALTERA CORP INTEL CORP
Part Package Code BGA
Package Description 29 X 29 MM, 1 MM PITCH, FBGA-780 BGA, BGA780,28X28,40
Pin Count 780
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B780 S-PBGA-B780
JESD-609 Code e0 e1
Length 29 mm 29 mm
Moisture Sensitivity Level 3 3
Number of CLBs 2852 2852
Number of Inputs 706 597
Number of Logic Cells 25660 25660
Number of Outputs 706 597
Number of Terminals 780 780
Organization 2852 CLBS 2566 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA780,28X28,40 BGA780,28X28,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 220
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.5 mm 3.5 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 29 mm 29 mm
Base Number Matches 2 2
Operating Temperature-Max 85 °C
Operating Temperature-Min
Temperature Grade COMMERCIAL EXTENDED

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