EP1S25F780I5ES
vs
EP1S25F780I6N
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
INTEL CORP
|
ALTERA CORP
|
| Package Description |
29 X 29 MM, 1 MM PITCH, FBGA-780
|
BGA, BGA780,28X28,40
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PBGA-B780
|
S-PBGA-B780
|
| JESD-609 Code |
e0
|
e1
|
| Length |
29 mm
|
29 mm
|
| Number of CLBs |
2566
|
2852
|
| Number of Logic Cells |
25660
|
25660
|
| Number of Terminals |
780
|
780
|
| Operating Temperature-Max |
100 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max |
1.575 V
|
1.575 V
|
| Supply Voltage-Min |
1.425 V
|
1.425 V
|
| Supply Voltage-Nom |
1.5 V
|
1.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
TIN LEAD
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
29 mm
|
29 mm
|
| Base Number Matches |
2
|
2
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
780
|
| Samacsys Manufacturer |
|
Intel
|
| Moisture Sensitivity Level |
|
3
|
| Number of Inputs |
|
706
|
| Number of Outputs |
|
706
|
| Organization |
|
2852 CLBS
|
| Package Equivalence Code |
|
BGA780,28X28,40
|
| Peak Reflow Temperature (Cel) |
|
245
|
| Seated Height-Max |
|
3.5 mm
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare EP1S25F780I5ES with alternatives
Compare EP1S25F780I6N with alternatives