EP1S25F780C5N vs EP1S25F780I6 feature comparison

EP1S25F780C5N Intel Corporation

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EP1S25F780I6 Altera Corporation

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Rohs Code Yes No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEL CORP ALTERA CORP
Package Description BGA, BGA780,28X28,40 29 X 29 MM, 1 MM PITCH, FBGA-780
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B780 S-PBGA-B780
JESD-609 Code e1 e0
Length 29 mm 29 mm
Moisture Sensitivity Level 3 3
Number of CLBs 2852 2852
Number of Inputs 597 706
Number of Logic Cells 25660 25660
Number of Outputs 597 706
Number of Terminals 780 780
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 2566 CLBS 2852 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA780,28X28,40 BGA780,28X28,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.5 mm 3.5 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL EXTENDED
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 29 mm 29 mm
Base Number Matches 1 3
Pbfree Code No
Part Package Code BGA
Pin Count 780
Peak Reflow Temperature (Cel) 220
Time@Peak Reflow Temperature-Max (s) 20

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