EP1S25F780C5N
vs
EP1S25F780I6
feature comparison
All Stats
Differences Only
Rohs Code
Yes
No
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEL CORP
ALTERA CORP
Package Description
BGA, BGA780,28X28,40
29 X 29 MM, 1 MM PITCH, FBGA-780
Reach Compliance Code
compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B780
S-PBGA-B780
JESD-609 Code
e1
e0
Length
29 mm
29 mm
Moisture Sensitivity Level
3
3
Number of CLBs
2852
2852
Number of Inputs
597
706
Number of Logic Cells
25660
25660
Number of Outputs
597
706
Number of Terminals
780
780
Operating Temperature-Max
85 °C
Operating Temperature-Min
Organization
2566 CLBS
2852 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA780,28X28,40
BGA780,28X28,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.5 mm
3.5 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL EXTENDED
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
29 mm
29 mm
Base Number Matches
1
3
Pbfree Code
No
Part Package Code
BGA
Pin Count
780
Peak Reflow Temperature (Cel)
220
Time@Peak Reflow Temperature-Max (s)
20
Compare EP1S25F780C5N with alternatives
Compare EP1S25F780I6 with alternatives