EP1S25F780C5ES vs EP1S25F780I7ES feature comparison

EP1S25F780C5ES Intel Corporation

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EP1S25F780I7ES Intel Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer INTEL CORP INTEL CORP
Package Description BGA, 29 X 29 MM, 1 MM PITCH, FBGA-780
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B780 S-PBGA-B780
JESD-609 Code e0 e0
Number of Terminals 780 780
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
Base Number Matches 2 2
Length 29 mm
Number of CLBs 2566
Number of Logic Cells 25660
Terminal Pitch 1 mm
Width 29 mm

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Compare EP1S25F780I7ES with alternatives