EP1S25F672I7N
vs
EP1S25F672C7
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
INTEL CORP
|
ALTERA CORP
|
Package Description |
BGA, BGA672,26X26,40
|
35 X 35 MM, 1.27 MM PITCH, BGA-672
|
Reach Compliance Code |
compliant
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Intel
|
|
JESD-30 Code |
S-PBGA-B672
|
S-PBGA-B672
|
JESD-609 Code |
e1
|
e0
|
Moisture Sensitivity Level |
3
|
3
|
Number of Inputs |
473
|
706
|
Number of Logic Cells |
25660
|
25660
|
Number of Outputs |
473
|
706
|
Number of Terminals |
672
|
672
|
Operating Temperature-Max |
100 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
2566 CLBS
|
2852 CLBS
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA672,26X26,40
|
BGA672,26X26,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Max |
1.575 V
|
1.575 V
|
Supply Voltage-Min |
1.425 V
|
1.425 V
|
Supply Voltage-Nom |
1.5 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Base Number Matches |
2
|
2
|
Pbfree Code |
|
No
|
Part Package Code |
|
BGA
|
Pin Count |
|
672
|
Length |
|
27 mm
|
Number of CLBs |
|
2852
|
Peak Reflow Temperature (Cel) |
|
220
|
Seated Height-Max |
|
3.5 mm
|
Temperature Grade |
|
COMMERCIAL EXTENDED
|
Time@Peak Reflow Temperature-Max (s) |
|
20
|
Width |
|
27 mm
|
|
|
|
Compare EP1S25F672I7N with alternatives
Compare EP1S25F672C7 with alternatives