EP1S25F672C7ES vs EP1S25F672C7 feature comparison

EP1S25F672C7ES Altera Corporation

Buy Now Datasheet

EP1S25F672C7 Intel Corporation

Buy Now Datasheet
Pbfree Code No
Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ALTERA CORP INTEL CORP
Part Package Code BGA
Package Description 35 X 35 MM, 1.27 MM PITCH, BGA-672 35 X 35 MM, 1.27 MM PITCH, BGA-672
Pin Count 672
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B672 S-PBGA-B672
JESD-609 Code e0 e0
Number of Terminals 672 672
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER COMMERCIAL EXTENDED
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
Base Number Matches 2 2
Length 27 mm
Moisture Sensitivity Level 3
Number of CLBs 2852
Number of Inputs 706
Number of Logic Cells 25660
Number of Outputs 706
Organization 2852 CLBS
Package Equivalence Code BGA672,26X26,40
Seated Height-Max 3.5 mm
Terminal Pitch 1 mm
Width 27 mm

Compare EP1S25F672C7ES with alternatives

Compare EP1S25F672C7 with alternatives