EP1S25F1020I6
vs
EP1S25F1020I6N
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
ALTERA CORP
INTEL CORP
Part Package Code
BGA
Package Description
33 X 33 MM, 1 MM PITCH, FBGA-1020
BGA, BGA1020,31X31,50
Pin Count
1020
Reach Compliance Code
not_compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B1020
S-PBGA-B1020
JESD-609 Code
e0
e1
Moisture Sensitivity Level
3
3
Number of Inputs
702
706
Number of Logic Cells
25660
25660
Number of Outputs
702
706
Number of Terminals
1020
1020
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA1020,31X31,50
BGA1020,31X31,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
220
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
Base Number Matches
2
2
Length
33 mm
Operating Temperature-Max
100 °C
Operating Temperature-Min
-40 °C
Organization
2566 CLBS
Seated Height-Max
3.5 mm
Width
33 mm
Compare EP1S25F1020I6 with alternatives
Compare EP1S25F1020I6N with alternatives