EP1S20F780C7 vs EP1S20F780I5ES feature comparison

EP1S20F780C7 Intel Corporation

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EP1S20F780I5ES Intel Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer INTEL CORP INTEL CORP
Package Description 29 X 29 MM, 1 MM PITCH, FBGA-780 29 X 29 MM, 1 MM PITCH, FBGA-780
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B780 S-PBGA-B780
JESD-609 Code e0 e0
Length 29 mm 29 mm
Moisture Sensitivity Level 3
Number of CLBs 2132 1846
Number of Inputs 586 586
Number of Logic Cells 18460 18460
Number of Outputs 586 586
Number of Terminals 780 780
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C
Organization 1846 CLBS 1846 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA780,28X28,40 BGA780,28X28,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.5 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL EXTENDED
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 29 mm 29 mm
Base Number Matches 2 2

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