EP1S20F672I7 vs EP1S20F672I6 feature comparison

EP1S20F672I7 Intel Corporation

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EP1S20F672I6 Intel Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer INTEL CORP INTEL CORP
Package Description 35 X 35 MM, 1.27 MM PITCH, BGA-672 35 X 35 MM, 1.27 MM PITCH, BGA-672
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B672 S-PBGA-B672
Number of CLBs 1846 1846
Number of Inputs 426 586
Number of Logic Cells 18460 18460
Number of Outputs 426 586
Number of Terminals 672 672
Operating Temperature-Max 100 °C 100 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1846 CLBS 1846 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA672,26X26,40 BGA672,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Number Matches 3 2
JESD-609 Code e0
Length 27 mm
Terminal Finish TIN LEAD
Width 27 mm

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