EP1S20F672C5ES vs EP1S20F672I7 feature comparison

EP1S20F672C5ES Intel Corporation

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EP1S20F672I7 Intel Corporation

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Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer INTEL CORP INTEL CORP
Package Description 35 X 35 MM, 1.27 MM PITCH, BGA-672 35 X 35 MM, 1.27 MM PITCH, BGA-672
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B672 S-PBGA-B672
JESD-609 Code e0
Length 27 mm
Number of CLBs 1846 1846
Number of Inputs 426 426
Number of Logic Cells 18460 18460
Number of Outputs 426 426
Number of Terminals 672 672
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C
Organization 1846 CLBS 1846 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA672,26X26,40 BGA672,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm
Base Number Matches 2 2
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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