EP1K50QC208-2N
vs
EPF10K50SQC208-1X
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
ALTERA CORP
|
INTEL CORP
|
Part Package Code |
QFP
|
|
Package Description |
PLASTIC, QFP-208
|
FQFP, QFP208,1.2SQ,20
|
Pin Count |
208
|
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Intel
|
|
Clock Frequency-Max |
37.5 MHz
|
|
JESD-30 Code |
S-PQFP-G208
|
S-PQFP-G208
|
JESD-609 Code |
e3
|
e0
|
Length |
28 mm
|
28 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of I/O Lines |
147
|
147
|
Number of Inputs |
147
|
147
|
Number of Logic Cells |
2880
|
2880
|
Number of Outputs |
147
|
147
|
Number of Terminals |
208
|
208
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
147 I/O
|
147 I/O
|
Output Function |
MIXED
|
MIXED
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
FQFP
|
FQFP
|
Package Equivalence Code |
QFP208,1.2SQ,20
|
QFP208,1.2SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, FINE PITCH
|
FLATPACK, FINE PITCH
|
Peak Reflow Temperature (Cel) |
245
|
|
Programmable Logic Type |
LOADABLE PLD
|
LOADABLE PLD
|
Propagation Delay |
0.4 ns
|
0.3 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.1 mm
|
4.1 mm
|
Supply Voltage-Max |
2.625 V
|
2.625 V
|
Supply Voltage-Min |
2.375 V
|
2.375 V
|
Supply Voltage-Nom |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
MATTE TIN
|
TIN LEAD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
28 mm
|
28 mm
|
Base Number Matches |
2
|
2
|
|
|
|
Compare EP1K50QC208-2N with alternatives
Compare EPF10K50SQC208-1X with alternatives