EP1C4F324C6
vs
EP1C4F324C8ES
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
Package Description |
19 X 19 MM, 1.0 MM PITCH, FBGA-324
|
BGA,
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Intel
|
|
Clock Frequency-Max |
405 MHz
|
275 MHz
|
JESD-30 Code |
S-PBGA-B324
|
S-PBGA-B324
|
JESD-609 Code |
e0
|
e0
|
Length |
19 mm
|
19 mm
|
Moisture Sensitivity Level |
3
|
|
Number of CLBs |
400
|
4000
|
Number of Inputs |
249
|
|
Number of Logic Cells |
4000
|
|
Number of Outputs |
249
|
|
Number of Terminals |
324
|
324
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
|
|
Organization |
400 CLBS
|
4000 CLBS
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA324,18X18,40
|
BGA324,18X18,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.2 mm
|
2.2 mm
|
Supply Voltage-Max |
1.575 V
|
1.575 V
|
Supply Voltage-Min |
1.425 V
|
1.425 V
|
Supply Voltage-Nom |
1.5 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
OTHER
|
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
19 mm
|
19 mm
|
Base Number Matches |
3
|
1
|
|
|
|
Compare EP1C4F324C6 with alternatives
Compare EP1C4F324C8ES with alternatives