EP1C3T100I7N
vs
EP1C3T100C7N
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
ALTERA CORP
|
INTEL CORP
|
Part Package Code |
QFP
|
|
Package Description |
16 X 16 MM, 0.50 MM PITCH, TQFP-100
|
TFQFP, TQFP100,.63SQ
|
Pin Count |
100
|
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Intel
|
Intel
|
Clock Frequency-Max |
320 MHz
|
320 MHz
|
JESD-30 Code |
S-PQFP-G100
|
S-PQFP-G100
|
JESD-609 Code |
e3
|
e3
|
Length |
14 mm
|
14 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
291
|
291
|
Number of Inputs |
65
|
65
|
Number of Logic Cells |
2910
|
2910
|
Number of Outputs |
65
|
65
|
Number of Terminals |
100
|
100
|
Operating Temperature-Max |
100 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
291 CLBS
|
291 CLBS
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TFQFP
|
TFQFP
|
Package Equivalence Code |
TQFP100,.63SQ
|
TQFP100,.63SQ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, THIN PROFILE, FINE PITCH
|
FLATPACK, THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Supply Voltage-Max |
1.575 V
|
1.575 V
|
Supply Voltage-Min |
1.425 V
|
1.425 V
|
Supply Voltage-Nom |
1.5 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
OTHER
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
14 mm
|
14 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare EP1C3T100I7N with alternatives
Compare EP1C3T100C7N with alternatives