EP1C3T100C8
vs
EP1C3T100I8ES
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
ALTERA CORP
|
INTEL CORP
|
| Part Package Code |
QFP
|
|
| Package Description |
TQFP-100
|
16 X 16 MM, 0.50 MM PITCH, LEAD FREE, TQFP-100
|
| Pin Count |
100
|
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Intel
|
|
| Clock Frequency-Max |
275 MHz
|
275 MHz
|
| JESD-30 Code |
S-PQFP-G100
|
S-PQFP-G100
|
| JESD-609 Code |
e0
|
e0
|
| Length |
14 mm
|
14 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
291
|
2910
|
| Number of Inputs |
65
|
|
| Number of Logic Cells |
2910
|
|
| Number of Outputs |
65
|
|
| Number of Terminals |
100
|
100
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
|
|
| Organization |
291 CLBS
|
2910 CLBS
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFQFP
|
TFQFP
|
| Package Equivalence Code |
TQFP100,.63SQ
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, THIN PROFILE, FINE PITCH
|
FLATPACK, THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
235
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Supply Voltage-Max |
1.575 V
|
1.575 V
|
| Supply Voltage-Min |
1.425 V
|
1.425 V
|
| Supply Voltage-Nom |
1.5 V
|
1.5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
OTHER
|
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
|
| Width |
14 mm
|
14 mm
|
| Base Number Matches |
3
|
1
|
|
|
|
Compare EP1C3T100C8 with alternatives
Compare EP1C3T100I8ES with alternatives