EP1C12F324C7 vs EP1C12F324C6 feature comparison

EP1C12F324C7 Intel Corporation

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EP1C12F324C6 Intel Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP INTEL CORP
Package Description 19 X 19 MM, 1.0 MM PITCH, FBGA-324 FBGA-324
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 320 MHz 405 MHz
JESD-30 Code S-PBGA-B324 S-PBGA-B324
JESD-609 Code e0 e0
Length 19 mm 19 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1206 1206
Number of Inputs 249 249
Number of Logic Cells 12060 12060
Number of Outputs 249 249
Number of Terminals 324 324
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 1206 CLBS 1206 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA324,18X18,40 BGA324,18X18,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.2 mm 2.2 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Temperature Grade OTHER OTHER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 19 mm 19 mm
Base Number Matches 2 2

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