EP1C12F256C7 vs EP1C12F256I6 feature comparison

EP1C12F256C7 Intel Corporation

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EP1C12F256I6 Intel Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer INTEL CORP INTEL CORP
Package Description FBGA-256 FBGA-256
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 320 MHz 405 MHz
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e0 e0
Length 17 mm 17 mm
Moisture Sensitivity Level 3
Number of CLBs 1206 1206
Number of Inputs 185 185
Number of Logic Cells 12060 12060
Number of Outputs 185 185
Number of Terminals 256 256
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C
Organization 1206 CLBS 1206 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 220
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.2 mm 2.2 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Temperature Grade OTHER INDUSTRIAL
Terminal Finish Tin/Lead (Sn63Pb37) TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 17 mm 17 mm
Base Number Matches 2 2

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