Findchips: Compare EP1C12F256C6N vs EP1C12F256I7

EP1C12F256C6N vs EP1C12F256I7 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes	No
Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	INTEL CORP	INTEL CORP
Package Description	FBGA-256	FBGA-256
Reach Compliance Code	compliant	not_compliant
HTS Code	8542.39.00.01	8542.39.00.01
Clock Frequency-Max	405 MHz	320 MHz
JESD-30 Code	S-PBGA-B256	S-PBGA-B256
JESD-609 Code	e1	e0
Length	17 mm	17 mm
Moisture Sensitivity Level	3	3
Number of CLBs	1206	1206
Number of Inputs	185	185
Number of Logic Cells	12060	12060
Number of Outputs	185	185
Number of Terminals	256	256
Operating Temperature-Max	85 °C	100 °C
Operating Temperature-Min		-40 °C
Organization	1206 CLBS	1206 CLBS
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Equivalence Code	BGA256,16X16,40	BGA256,16X16,40
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	2.2 mm	2.2 mm
Supply Voltage-Max	1.575 V	1.575 V
Supply Voltage-Min	1.425 V	1.425 V
Supply Voltage-Nom	1.5 V	1.5 V
Surface Mount	YES	YES
Temperature Grade	OTHER	INDUSTRIAL
Terminal Finish	TIN SILVER COPPER	Tin/Lead (Sn63Pb37)
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Width	17 mm	17 mm
Base Number Matches	2	2
Peak Reflow Temperature (Cel)		220
Time@Peak Reflow Temperature-Max (s)		20
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays