EM6A8160TSC-5G
vs
M13S64164A-4BVAG2Y
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Contact Manufacturer
Active
Ihs Manufacturer
ETRON TECHNOLOGY INC
ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC
Package Description
TSOP2,
TFBGA,
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.02
8542.32.00.02
Access Mode
FOUR BANK PAGE BURST
FOUR BANK PAGE BURST
Access Time-Max
0.7 ns
0.7 ns
Additional Feature
AUTO/SELF REFRESH
AUTO REFRESH
JESD-30 Code
R-PDSO-G66
R-PBGA-B60
Length
22.22 mm
13 mm
Memory Density
67108864 bit
67108864 bit
Memory IC Type
DDR DRAM
DDR1 DRAM
Memory Width
16
16
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
66
60
Number of Words
4194304 words
4194304 words
Number of Words Code
4000000
4000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
105 °C
Operating Temperature-Min
-40 °C
Organization
4MX16
4MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP2
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
1.2 mm
1.2 mm
Self Refresh
YES
Supply Voltage-Max (Vsup)
2.7 V
2.7 V
Supply Voltage-Min (Vsup)
2.3 V
2.3 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
GULL WING
BALL
Terminal Pitch
0.65 mm
0.8 mm
Terminal Position
DUAL
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
10.16 mm
8 mm
Base Number Matches
1
1
Compare EM6A8160TSC-5G with alternatives
Compare M13S64164A-4BVAG2Y with alternatives