ELANSC520-100AC vs ELANSC520-100AI feature comparison

ELANSC520-100AC AMD

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ELANSC520-100AI AMD

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC ADVANCED MICRO DEVICES INC
Part Package Code BGA BGA
Package Description PLASTIC, BGA-388 PLASTIC, BGA-388
Pin Count 388 388
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer AMD
Has ADC NO NO
Additional Feature ALSO REQUIRES 3.3V I/O SUPPLY ALSO REQUIRES 3.3V I/O SUPPLY
Address Bus Width 32 32
Bit Size 32 32
Clock Frequency-Max 33.33 MHz 33.33 MHz
DAC Channels NO NO
DMA Channels YES YES
External Data Bus Width 32 32
JESD-30 Code S-PBGA-B388 S-PBGA-B388
JESD-609 Code e0 e0
Length 35 mm 35 mm
Moisture Sensitivity Level 4 4
Number of I/O Lines 32 32
Number of Terminals 388 388
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C
PWM Channels NO NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA388,26X26,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 250 250
Qualification Status Not Qualified Not Qualified
ROM Programmability FLASH FLASH
Seated Height-Max 2.46 mm 2.46 mm
Speed 100 MHz 100 MHz
Supply Current-Max 540 mA
Supply Voltage-Max 2.625 V 2.625 V
Supply Voltage-Min 2.375 V 2.375 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 35 mm 35 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1