ELANSC520-100AC
vs
ELANSC520-100AI
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
ADVANCED MICRO DEVICES INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
PLASTIC, BGA-388
|
PLASTIC, BGA-388
|
Pin Count |
388
|
388
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Samacsys Manufacturer |
AMD
|
|
Has ADC |
NO
|
NO
|
Additional Feature |
ALSO REQUIRES 3.3V I/O SUPPLY
|
ALSO REQUIRES 3.3V I/O SUPPLY
|
Address Bus Width |
32
|
32
|
Bit Size |
32
|
32
|
Clock Frequency-Max |
33.33 MHz
|
33.33 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
YES
|
YES
|
External Data Bus Width |
32
|
32
|
JESD-30 Code |
S-PBGA-B388
|
S-PBGA-B388
|
JESD-609 Code |
e0
|
e0
|
Length |
35 mm
|
35 mm
|
Moisture Sensitivity Level |
4
|
4
|
Number of I/O Lines |
32
|
32
|
Number of Terminals |
388
|
388
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
PWM Channels |
NO
|
NO
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA388,26X26,50
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
250
|
250
|
Qualification Status |
Not Qualified
|
Not Qualified
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
2.46 mm
|
2.46 mm
|
Speed |
100 MHz
|
100 MHz
|
Supply Current-Max |
540 mA
|
|
Supply Voltage-Max |
2.625 V
|
2.625 V
|
Supply Voltage-Min |
2.375 V
|
2.375 V
|
Supply Voltage-Nom |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
35 mm
|
35 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
1
|
1
|
|
|
|