EL5327CL-T13
vs
EL5327CL
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
INTERSIL CORP
|
INTERSIL CORP
|
| Part Package Code |
QFN
|
QFN
|
| Package Description |
LPP-24
|
LPP-24
|
| Pin Count |
24
|
24
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
BUFFER
|
BUFFER
|
| Average Bias Current-Max (IIB) |
0.05 µA
|
0.05 µA
|
| Bandwidth (3dB)-Nom |
2.5 MHz
|
2.5 MHz
|
| Bias Current-Max (IIB) @25C |
0.05 µA
|
|
| Input Offset Voltage-Max |
15000 µV
|
15000 µV
|
| JESD-30 Code |
R-XQCC-N24
|
R-XQCC-N24
|
| JESD-609 Code |
e0
|
|
| Length |
5 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Neg Supply Voltage Limit-Max |
-9 V
|
-9 V
|
| Neg Supply Voltage-Nom (Vsup) |
-5 V
|
-5 V
|
| Number of Functions |
10
|
10
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
|
| Package Equivalence Code |
LCC24,.16X.2,20
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
|
| Slew Rate-Min |
0.9 V/us
|
|
| Slew Rate-Nom |
2.2 V/us
|
1.5 V/us
|
| Supply Current-Max |
2.1 mA
|
|
| Supply Voltage Limit-Max |
9 V
|
9 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
4 mm
|
|
| Base Number Matches |
1
|
6
|
|
|
|
Compare EL5327CL-T13 with alternatives
Compare EL5327CL with alternatives