EL1883ISZ
vs
LM1881N-X/NOPB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTERSIL CORP
NATIONAL SEMICONDUCTOR CORP
Part Package Code
SOIC
DIP
Package Description
SOP-8
DIP, DIP8,.3
Pin Count
8
8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
Consumer IC Type
SYNC SEPARATOR IC
SYNC SEPARATOR IC
JESD-30 Code
R-PDSO-G8
R-PDIP-T8
JESD-609 Code
e3
e3
Length
4.89 mm
9.817 mm
Moisture Sensitivity Level
3
1
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Equivalence Code
SOP8,.25
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.68 mm
5.08 mm
Supply Current-Max
3 mA
12 mA
Supply Voltage-Max (Vsup)
5 V
12 V
Supply Voltage-Min (Vsup)
3 V
5 V
Surface Mount
YES
NO
Technology
CMOS
BIPOLAR
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Matte Tin (Sn) - annealed
MATTE TIN
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
3.9 mm
7.62 mm
Base Number Matches
2
1
Pbfree Code
Compare EL1883ISZ with alternatives
Compare LM1881N-X/NOPB with alternatives