EL1883ISZ
vs
LM1881N-X/NOPB
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
INTERSIL CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
SOIC
|
DIP
|
| Package Description |
SOP-8
|
DIP, DIP8,.3
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Consumer IC Type |
SYNC SEPARATOR IC
|
SYNC SEPARATOR IC
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDIP-T8
|
| JESD-609 Code |
e3
|
e3
|
| Length |
4.89 mm
|
9.817 mm
|
| Moisture Sensitivity Level |
3
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
DIP
|
| Package Equivalence Code |
SOP8,.25
|
DIP8,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.68 mm
|
5.08 mm
|
| Supply Current-Max |
3 mA
|
12 mA
|
| Supply Voltage-Max (Vsup) |
5 V
|
12 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
BIPOLAR
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
3.9 mm
|
7.62 mm
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
Yes
|
|
|
|
Compare EL1883ISZ with alternatives
Compare LM1881N-X/NOPB with alternatives