EL1881CSZ
vs
BA7071F-E2
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
ROHM CO LTD
|
| Part Package Code |
SOICN
|
SOIC
|
| Package Description |
SOIC-8
|
LSOP, SOP8,.25
|
| Pin Count |
8
|
8
|
| Manufacturer Package Code |
M8.15E
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Date Of Intro |
2017-09-26
|
|
| Samacsys Manufacturer |
Renesas Electronics
|
ROHM Semiconductor
|
| Consumer IC Type |
SYNC SEPARATOR IC
|
SYNC SEPARATOR IC
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
| JESD-609 Code |
e3
|
e2
|
| Length |
4.9 mm
|
5 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
75 °C
|
| Operating Temperature-Min |
-40 °C
|
-20 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
LSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, LOW PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
1.75 mm
|
1.6 mm
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
BIPOLAR
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
MATTE TIN
|
TIN COPPER
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
3.9 mm
|
4.4 mm
|
| Base Number Matches |
4
|
2
|
| Package Equivalence Code |
|
SOP8,.25
|
| Qualification Status |
|
Not Qualified
|
| Supply Current-Max |
|
8.6 mA
|
| Supply Voltage-Max (Vsup) |
|
7.5 V
|
| Supply Voltage-Min (Vsup) |
|
2.85 V
|
|
|
|
Compare EL1881CSZ with alternatives
Compare BA7071F-E2 with alternatives