EK681024MJ-10
vs
KM681002CTI-1000
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
EUREKA MICROELECTRONICS INC
SAMSUNG SEMICONDUCTOR INC
Package Description
,
TSOP2,
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.B.2.B
3A991.B.2.B
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
10 ns
10 ns
JESD-30 Code
R-PDSO-J32
R-PDSO-G32
Memory Density
1048576 bit
1048576 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
128KX8
128KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOJ
TSOP2
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
J BEND
GULL WING
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Part Package Code
TSOP2
Pin Count
32
Length
20.95 mm
Seated Height-Max
1.2 mm
Terminal Pitch
1.27 mm
Width
10.16 mm
Compare EK681024MJ-10 with alternatives
Compare KM681002CTI-1000 with alternatives