EGP10B
vs
EGP10B-AP
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Contact Manufacturer
Obsolete
Ihs Manufacturer
JINAN JINGHENG ELECTRONICS CO LTD
MICRO COMMERCIAL COMPONENTS CORP
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
Application
SUPER FAST RECOVERY
GENERAL PURPOSE
Breakdown Voltage-Min
100 V
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
RECTIFIER DIODE
RECTIFIER DIODE
Forward Voltage-Max (VF)
0.95 V
JEDEC-95 Code
DO-41
DO-41
JESD-30 Code
O-PALF-W2
O-PALF-W2
Non-rep Pk Forward Current-Max
30 A
30 A
Number of Elements
1
1
Number of Phases
1
1
Number of Terminals
2
2
Operating Temperature-Max
125 °C
Operating Temperature-Min
-65 °C
Output Current-Max
1 A
1 A
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Reference Standard
MIL-STD-750
Rep Pk Reverse Voltage-Max
100 V
100 V
Reverse Current-Max
5 µA
Reverse Recovery Time-Max
0.035 µs
0.05 µs
Reverse Test Voltage
100 V
Surface Mount
NO
NO
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Base Number Matches
17
1
Rohs Code
Yes
Part Package Code
DO-41
Package Description
O-PALF-W2
Pin Count
2
HTS Code
8541.10.00.80
JESD-609 Code
e3
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Terminal Finish
MATTE TIN
Time@Peak Reflow Temperature-Max (s)
10
Compare EGP10B-AP with alternatives