EGL34A
vs
HSM105-W
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
DIOTEC SEMICONDUCTOR AG
|
RECTRON LTD
|
| Part Package Code |
DO-213AA
|
MELF
|
| Package Description |
ROHS COMPLIANT, PLASTIC, MINIMELF-2
|
MELF-2
|
| Pin Count |
2
|
2
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.70
|
8541.10.00.80
|
| Application |
SUPER FAST RECOVERY
|
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
1.25 V
|
|
| JEDEC-95 Code |
DO-213AA
|
|
| JESD-30 Code |
O-PELF-R2
|
O-PELF-R2
|
| JESD-609 Code |
e1
|
e3
|
| Moisture Sensitivity Level |
1
|
|
| Non-rep Pk Forward Current-Max |
10 A
|
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
175 °C
|
|
| Operating Temperature-Min |
-50 °C
|
|
| Output Current-Max |
0.5 A
|
1 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Rep Pk Reverse Voltage-Max |
50 V
|
400 V
|
| Reverse Current-Max |
5 µA
|
|
| Reverse Recovery Time-Max |
0.05 µs
|
0.05 µs
|
| Reverse Test Voltage |
50 V
|
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
Matte Tin (Sn)
|
| Terminal Form |
WRAP AROUND
|
WRAP AROUND
|
| Terminal Position |
END
|
END
|
| Base Number Matches |
1
|
1
|
| Additional Feature |
|
METALLURGICALLY BONDED
|
| Time@Peak Reflow Temperature-Max (s) |
|
10
|
|
|
|
Compare EGL34A with alternatives
Compare HSM105-W with alternatives