EFM8LB10F16E-B-QFN32
vs
EFM8LB10F16E-B-QFN32R
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SILICON LABORATORIES INC
SILICON LABORATORIES INC
Package Description
HVQCCN,
HVQCCN,
Reach Compliance Code
compliant
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Date Of Intro
2016-11-07
2017-11-10
JESD-30 Code
S-XQCC-N32
S-XQCC-N32
Length
4 mm
4 mm
Number of Terminals
32
32
Operating Temperature-Max
105 °C
105 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
HVQCCN
HVQCCN
Package Equivalence Code
LCC32,.16SQ,16
LCC32,.16SQ,16
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
260
260
Seated Height-Max
0.55 mm
0.55 mm
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
2.2 V
2.2 V
Supply Voltage-Nom
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.4 mm
0.4 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
30
Width
4 mm
4 mm
uPs/uCs/Peripheral ICs Type
SoC
SoC
Base Number Matches
2
1
Compare EFM8LB10F16E-B-QFN32 with alternatives
Compare EFM8LB10F16E-B-QFN32R with alternatives