EFM8BB31F64I-C-QFN24R
vs
EFM8BB31F64G-B-QFN24R
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SILICON LABORATORIES INC
SILICON LABORATORIES INC
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Date Of Intro
2019-01-22
Has ADC
YES
YES
Address Bus Width
Bit Size
8
8
Clock Frequency-Max
50 MHz
50 MHz
DMA Channels
YES
NO
External Data Bus Width
JESD-609 Code
e3
Length
3 mm
3 mm
Moisture Sensitivity Level
2
Number of I/O Lines
21
20
Number of Terminals
24
24
PWM Channels
YES
YES
Package Code
HVQCCN
HVQCCN
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Speed
50 MHz
50 MHz
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
2.2 V
3 V
Supply Voltage-Nom
3 V
3 V
Surface Mount
YES
YES
Terminal Finish
MATTE TIN
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.4 mm
0.4 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
40
NOT SPECIFIED
Width
3 mm
3 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
1
1
Pbfree Code
Package Description
,
Boundary Scan
NO
CPU Family
8051
DAC Channels
YES
Format
FIXED POINT
Integrated Cache
NO
JESD-30 Code
S-XQCC-N24
Low Power Mode
YES
Number of External Interrupts
2
Number of Serial I/Os
2
Number of Timers
7
On Chip Data RAM Width
8
On Chip Program ROM Width
8
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
UNSPECIFIED
Package Equivalence Code
LCC24,.12SQ,16
RAM (bytes)
4352
ROM (words)
65536
ROM Programmability
FLASH
Seated Height-Max
0.9 mm
Supply Current-Max
14.4 mA
Technology
CMOS
Compare EFM8BB31F64I-C-QFN24R with alternatives
Compare EFM8BB31F64G-B-QFN24R with alternatives