EFM8BB31F64G-C-QSOP24
vs
EFM8BB31F64I-B-5QFN32
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SILICON LABORATORIES INC
SILICON LABORATORIES INC
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Date Of Intro
2019-01-22
2017-07-28
Has ADC
YES
YES
Address Bus Width
Bit Size
8
8
CPU Family
8051
8051
Clock Frequency-Max
50 MHz
50 MHz
DAC Channels
YES
YES
DMA Channels
NO
NO
External Data Bus Width
JESD-30 Code
R-PDSO-G24
S-XQCC-N32
JESD-609 Code
e3
e3
Length
8.65 mm
5 mm
Moisture Sensitivity Level
2
2
Number of I/O Lines
21
29
Number of Terminals
24
32
On Chip Program ROM Width
8
8
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
SSOP
HVQCCN
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE, SHRINK PITCH
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
260
260
RAM (bytes)
4352
4352
ROM (words)
65536
65536
ROM Programmability
FLASH
FLASH
Speed
50 MHz
50 MHz
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
2.2 V
Supply Voltage-Nom
3 V
3 V
Surface Mount
YES
YES
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.635 mm
0.5 mm
Terminal Position
DUAL
QUAD
Time@Peak Reflow Temperature-Max (s)
40
40
Width
3.9 mm
5 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
1
1
Package Description
,
Boundary Scan
NO
Format
FIXED POINT
Integrated Cache
NO
Low Power Mode
YES
Number of External Interrupts
2
Number of Serial I/Os
2
Number of Timers
7
On Chip Data RAM Width
8
Package Equivalence Code
LCC32,.2SQ,20
Seated Height-Max
0.8 mm
Supply Current-Max
14.4 mA
Technology
CMOS
Compare EFM8BB31F64G-C-QSOP24 with alternatives
Compare EFM8BB31F64I-B-5QFN32 with alternatives